When IT development has gradually proceeded in the trend of light, thin, short and small styles, especially when the Notebook PC, Tablet PC and PDA etc. have gradually become the mobile devices inevitable to modern people, in fulfilling the characteristics applicable to mobile device set of high space density, the demand of memory module not only has to maintain high efficiency but also stable quality; how to shrink module space but still comprises of the characteristics of high quality, even upgrading to better data transmission efficiency have become essential tasks to be dealt with for various firms. In order to meet the development of the new generation technology and future market demand, TwinMOS has invested exorbitant R&D (Research & Development) resources to WLCSP technology application development, and has taken the lead in launching DDR 512MB SO-DIMM for exclusive use of this module of Notebook PC.

WLCSP is Wafer Level Chip Scale Packaging type. It differs from the conventional chip scale packaging (cutting first then packaging and testing whereas after packaging, at least 20% of mass is increased to the original chip). Such kind of new technology is to process packaging and testing on the entire wafer first, then cut into pieces of IC chips. Therefore, the mass after packaging is equivalent to the original dimension of the IC naked chip. The packaging method of WLCSP, not only can obviously shrink memory module size, but also can fulfill the high density in machine set's space demanded by mobile devices; on the other hand, on the performance of efficiency, it has upgraded the speed and stability of data transmission. Due to WLCSP technology applied to SO-DIMM memory module by TwinMOS, with regard to match with the support of mobile device memory module, a technology innovation windstorm shall be raised. And, memory modules of WLCSP series of TwinMOS is expected to become the mainstream of the market in the next generation.

Characteristics and advantages of WLCSP

· Packaging method of the smallest original chip dimension
The biggest advantage of WLCSP (Wafer Level Chip Scale Packaging) is the effective shrinkage of packaging mass so that it can match with mobile devices in fulfilling the demand of portable product's light, thin, short and small property.

· Short path and high stability of data transmission
When WLCSP packaging is adopted, as the circuit wiring line is short and thick (yellow line indicated as A to B) so that it can effectively increase the bandwidth of data transmission and reduce electric current loss, it can also upgrade the stability of data transmission.

· Good heat diffusion
As WLCSP is missing with conventional sealed up plastic or ceramics packaging so that the heat energy generated from IC chip operation can effectively be diffused without increasing the temperature of the main set. And this property is greatly advantageous to the heat diffusion problem of mobile devices.

WLCSP TSOPII

The greatly strengthened extremely good match of Intel Centrino
The data transmission bandwidth of WLCSP DDR SO-DIMM is better than the conventional packaging method. As CSP is available for higher operation frequency. And by using the motherboard furnished with Intel Centrino mobile operation technology to match with WFLCSP DDR SO-DIMM, it can elaborate its greatly reinforced super-strong efficiency more.

TwinMOS Technologies is announced by the well known market research institute iSupplu as the 4th largest memory module supplier in the world in 2002 by just merely behind the 3 largest American firms in leading Asia's professional memory module suppliers. TwinMOS Technologies plays a leading role in the industry with her sophisticated technology, and with her intensive communications with professional academic institutes, she constantly can introduce the latest module technology, varieties of developments and high-quality memory modules in the industry; meanwhile, TwinMOS has been maintaining the long-term good cooperating relationship with various international wafer firms. She can adequately control the supply and quality of the latest process wafer pellets.

About TwinMOS:
The goal of TwinMOS Technologies, founded in 1998, is to "Value Builds on Professionalism." Major product lines include : DRAM modules (DDR DIMM SO-DIMM, RIMM, SDR DIMM / SO-DIMM and SIMM etc) ; Flash memory products (CompactFlash? card, SmartMedia? card, MultiMedia? card, Secure digital? card, Mobile Disk and Card reader/writer), and Wireless LAN products (Mini-PCI interface card, PCMCIA wireless LAN card, etc.). Furthermore, TwinMOS also provides total solutions for its customers.

With its headquarters located at Hukou, Hsinchu, TwinMOS has built a worldwide business network with offices in Taipei, Japan, South Korea, Singapore, Hong Kong, Dubai, Germany, the Netherlands and the western United States.

The company passed the ISO9001: 2000 certification in 2002, which recognizes the company's outstanding quality of service, management and technological capabilities. (To know more information about TwinMOS, please visit - http://www.twinmos.com)

TwinMOS Technology Inc.
President of Business Group: Mr. Alan Pan
Press Contact Person: Jeffrey Wang
Tel: 02-2696-3939 ext. 1311
http://www.twinmos.com